Offline 3D SPIHigh Speed
VisionPro HSi
High-speed offline 3D solder paste measurement system packaged in a rugged, portable benchtop unit designed for the electronics production floor.
With minimal training, operators can perform accurate 3D measurements of solder paste pads, BGAs, and PCB features. The VisionPro HSi's completely automatic measurement process eliminates operator errors and delivers excellent repeatability — backed by a Windows 10/11 Pro interface built for the production environment.
High-speed offline 3D measurement
Rugged portable benchtop design
Windows 10/11 Pro interface
Inspects paste pads, BGAs, and PCB features
Fully automatic measurement process
Eliminates operator measurement errors
Excellent measurement repeatability
Production floor ready — minimal training
Full Specifications
Complete technical specifications and configuration options available upon request.
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