Inspection Insights Blog
Expert articles on electronics inspection, quality control, and manufacturing best practices
Inline vs. Offline SPI: Which Configuration is Right for Your Line?
Choosing the wrong SPI configuration costs time and money. Compare inline and offline setups across production volume, closed-loop requirements, traceability needs, and board mix to find the right fit.
PCB Stencil Design for Solder Paste Printing: Aperture Ratios, Thickness & Common Mistakes
Stencil design is where a solder paste process succeeds or fails. Learn how aperture ratio, foil thickness, and opening geometry determine paste deposit quality — and the most common mistakes to avoid.
Medical Device PCB Inspection: FDA, ISO 13485 & IPC Requirements
What inspection standards actually require for medical device electronics manufacturing. Covers FDA 21 CFR Part 820, ISO 13485, IPC-A-610 Class 3, and how automated inspection satisfies each.
Closed-Loop SPI to Printer Feedback: How Automatic Correction Works
Most SPI systems detect defects. Closed-loop systems prevent them. Learn exactly how automatic printer feedback works, what it can and can't correct, and how to implement it on your line.
AOI Programming Best Practices: Building Component Libraries That Hold Up
Good AOI programming separates systems that find real defects from ones your operators learn to ignore. Learn how to build component libraries that minimize false calls without letting escapes through.
10 Questions to Ask Every SPI Vendor Before You Buy
Most SPI sales presentations avoid difficult topics. These 10 questions surface hidden costs, vendor lock-in risks, real-world performance data, and support commitments vendors won't volunteer.
Complete SPI Buyer's Guide 2026
Everything you need to know to evaluate and select the right 3D SPI system. Covers measurement technologies, key features, budget planning, and vendor evaluation.
How to Choose an AOI System in 2026
Complete buyer's guide for automated optical inspection systems. Compare 2D vs 3D AOI, evaluate AI claims, and select the right system for your production needs.
The True Cost of Inspection: What Vendors Don't Tell You
Hidden costs can double your inspection investment over 7 years. Learn about software licensing traps, service contract escalation, and how to calculate real TCO.
AI in Inspection: What Actually Works vs. Marketing Hype
Cut through the AI marketing noise. Learn which AI features deliver real value in production inspection and which are just buzzwords on a spec sheet.
Understanding Multi-Reflection Suppression in SPI
How MRS technology works, when it matters, and what it means for your solder paste measurement accuracy. A technical deep dive for process engineers.
3D SPI vs 2D SPI: Why the Third Dimension Matters
Discover why 3D solder paste inspection provides superior defect detection compared to 2D systems, and when the investment makes sense for your operation.
Avoiding Vendor Lock-In When Choosing Inspection Equipment
Proprietary data formats and closed ecosystems can trap you. Learn to identify lock-in risks and choose open architecture systems that protect your investment.
How to Reduce False Calls in Automated Optical Inspection
False calls waste production time and reduce confidence in AOI systems. Learn proven strategies to minimize false positives while maintaining defect detection.
The Complete Guide to Inspection Integration in Industry 4.0
How to connect your inspection systems to MES, printers, and analytics platforms using IPC-CFX, OPC-UA, and REST APIs for true smart factory connectivity.
Understanding IPC-A-610 Class 2 vs Class 3 Requirements
IPC-A-610 defines acceptability standards for electronic assemblies. Understanding the differences between Class 2 and Class 3 is critical for setting inspection criteria.
Calculating ROI for Inspection Equipment: A Complete Guide
Inspection systems require significant investment. Learn how to calculate expected ROI including hard and soft costs, and typical payback periods.
The Critical Role of SPI in Preventing Solder Defects
Studies show 60-70% of solder defects originate at the paste printing stage. Discover how 3D SPI catches these defects early when they're easiest to fix.
Automotive Electronics: Meeting Zero-Defect Requirements
Automotive OEMs demand PPM defect rates in single digits. Learn about inspection strategies and documentation required for automotive electronics manufacturing.
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