Technical Application Notes
In-depth technical resources for electronics inspection engineers and quality professionals
Detailed procedures, optimization strategies, and implementation guides drawn from 34+ years of field experience
Optimizing 3D SPI Program Settings for Fine-Pitch Components
A comprehensive guide to configuring 3D solder paste inspection programs for fine-pitch and ultra-fine-pitch components. Covers threshold optimization, algorithm selection, measurement region configuration, and systematic approaches to reducing false calls while maintaining defect detection sensitivity.
Implementing Closed-Loop Feedback Between SPI and Stencil Printer
Step-by-step technical guide for implementing closed-loop communication between 3D SPI systems and stencil printers. Covers communication protocols, automatic offset correction, squeegee pressure adjustments, and validation procedures for maintaining optimal print quality.
Solder Defect Root Cause Analysis Using SPI and AOI Data
A practical methodology for correlating solder paste inspection and automated optical inspection data to identify root causes of solder defects. Includes defect categorization frameworks, data analysis techniques, fishbone diagrams, and corrective action procedures.
Why Application Notes Matter
Deep Technical Knowledge
Go beyond surface-level overviews with detailed implementation guidance from domain experts
Process Optimization
Proven methodologies to improve yield, reduce defects, and optimize inspection processes
Quality & Compliance
Meet automotive, medical, and aerospace quality standards with documented procedures
Best Practices
Industry-proven techniques refined through thousands of real-world implementations
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